features ratings at 25 c ambient temperature unless otherwise specified. data sheet no. BUDI-5000-1A 50 amp button diodes k11 m a f d b color ring denotes cathode tel.: (310) 767-1052 fax: (310) 767-7958 diotec electronics corp gardena, ca 90248 u.s.a 18020 hobart blvd., unit b non-repetitive peak reverse voltage (half wave, single phase, 60 hz peak) average forward rectified current @ t =125 c c o i o 50 peak forward surge current (8.3ms single half sine wave superimposed on rated load) i fsm 600 v rsm 60 120 240 480 1200 720 960 maximum dc blocking voltage maximum peak recurrent reverse voltage maximum rms voltage series number v rwm v dc v rrm bar bar bar bar bar bar bar 50 100 200 400 1000 600 800 5000 5001 5002 5004 5006 5008 5010 maximum forward voltage drop at 50 amp dc v fm 1.1 (typical 1.05) maximum thermal resistance, junction to case (note 1) maximum average dc reverse current at rated dc blocking voltage i rm r q jc c/w m a @ t = 25 c a o @ t = 100 c a o 1 50 0.8 junction operating and storage temperature range t j ,t stg c -65 to +175 bar50 1.15 notes: 1) single side cooled die size: 0.180" x 0.180" square rohs compliant features case: m finish: all metal surfaces are silver plated soldering temperature: 250 c maximum mounting position: any polarity: color band denotes cathode weight: 0.6 ounces (1.8 grams) o olded epoxy (ul flammability rating 94v-o) mechanical data inches millimeters min 5.97 4.19 5.46 9.78 dim a b d m f 5 nom max max 6.355.71 4.45 10.29 0.165 min 0.385 0.235 0.215 0.405 0.2500.225 5 nom 0.175 mechanical specification maximum ratings & electrical characteristics parameter (test conditions) symbol ratings units amps volts volts void free vacuum die soldering for maximum mechanical strength and heat dissipation (solder voids: typical < 2%, max. < 10% of die area) biggest effective die area for the 50 amp class of button diodes high temperature solder (solidus 287 c, liquidus 296 c) to allow higher operating and assembly temperatures copper headers are silver plated for easy soldering and superior solder joints o o
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